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Putting back heat sink (question)

Posted: Sun Apr 03, 2016 5:36 am
by zethirdone
Hello guys, so I'm currently waiting a xenoGC chip, but for fun I decided to open my cube to put a region switch on R5 for jap/usa. Everything went fine, I can now boot both. But just after I removed the heat sink to access to the circuit board, I did realize that normally when removing a heat sink, we need to remove thermal paste and apply new one. Normally do you keep the same thermal pad on the GameCube or your replace it with a thin layer of thermal paste?

Thank you

Re: Putting back heat sink (question)

Posted: Sun Apr 03, 2016 8:15 am
by novenary
Keep the pads as they are, it doesn't really matter.

Re: Putting back heat sink (question)

Posted: Sun Apr 03, 2016 3:36 pm
by zethirdone
Thanks for the info, and also for being active a lot on the forum.