Putting back heat sink (question)
Posted: Sun Apr 03, 2016 5:36 am
Hello guys, so I'm currently waiting a xenoGC chip, but for fun I decided to open my cube to put a region switch on R5 for jap/usa. Everything went fine, I can now boot both. But just after I removed the heat sink to access to the circuit board, I did realize that normally when removing a heat sink, we need to remove thermal paste and apply new one. Normally do you keep the same thermal pad on the GameCube or your replace it with a thin layer of thermal paste?
Thank you
Thank you