Mod Questions ( fan n thermal paste/pad )

Portables, case replacements, mods etc, all in here!
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Urska
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Joined: Sun Jul 29, 2018 7:11 pm

Mod Questions ( fan n thermal paste/pad )

Post by Urska » Sun Jul 29, 2018 7:14 pm

1, What fan can i put in a gamecube thats a upgrade?

2, adding LEDS to fan/vents ( like what Volt and can i just add it to the fan wire? or better spot)

3, what 2mm pads should i use? OR should i just use paste?

4, easy cooling upgrade?

<<GOAL>>
wana add some lights to my gamecube vents and give a cooling upgrade, its running a lil hot even after a cleanin

PS GC4L
Urska
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Re: Mod Questions ( fan n thermal paste/pad )

Post by Urska » Tue Jul 31, 2018 8:25 pm

guess this part of the forums are dead-ish.... I cut a fan to fit and used thermal paste seeing that's what was there. the store was out of thermal pads too xd will come back and check after my trip
Diminuendo
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Re: Mod Questions ( fan n thermal paste/pad )

Post by Diminuendo » Sun Aug 05, 2018 1:00 am

50mm fans seem to work;
viewtopic.php?t=3130

If you're looking for a good thermal paste Arctic Silver is pretty well recommended.
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Streetwalker
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Re: Mod Questions ( fan n thermal paste/pad )

Post by Streetwalker » Mon Aug 06, 2018 9:25 pm

Don't use thermal paste in the gamecube, the gap between the chips and the heatsink is way too big. You need thermal pads, 1.5 to 2mm thick if I recall correctly.
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emu_kidid
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Re: Mod Questions ( fan n thermal paste/pad )

Post by emu_kidid » Tue Aug 07, 2018 11:39 pm

Streetwalker wrote:
Mon Aug 06, 2018 9:25 pm
Don't use thermal paste in the gamecube, the gap between the chips and the heatsink is way too big. You need thermal pads, 1.5 to 2mm thick if I recall correctly.
I've seen it done but yeah, the risk is too great that it won't touch the heatsink or will heat up and puddle out or dry over time.
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Streetwalker
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Re: Mod Questions ( fan n thermal paste/pad )

Post by Streetwalker » Wed Aug 08, 2018 11:22 am

Thermal paste is meant to be used when the heatsink's cold surface is pressure-mounted directly on top of the IC. Any other case requires a thermal pad or thermal glue (only if that is also the mounting method) instead.
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