Putting back heat sink (question)

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zethirdone
Posts: 14
Joined: Wed Mar 30, 2016 5:10 pm

Putting back heat sink (question)

Post by zethirdone » Sun Apr 03, 2016 5:36 am

Hello guys, so I'm currently waiting a xenoGC chip, but for fun I decided to open my cube to put a region switch on R5 for jap/usa. Everything went fine, I can now boot both. But just after I removed the heat sink to access to the circuit board, I did realize that normally when removing a heat sink, we need to remove thermal paste and apply new one. Normally do you keep the same thermal pad on the GameCube or your replace it with a thin layer of thermal paste?

Thank you
novenary
Posts: 1756
Joined: Mon Dec 30, 2013 7:50 am

Re: Putting back heat sink (question)

Post by novenary » Sun Apr 03, 2016 8:15 am

Keep the pads as they are, it doesn't really matter.
zethirdone
Posts: 14
Joined: Wed Mar 30, 2016 5:10 pm

Re: Putting back heat sink (question)

Post by zethirdone » Sun Apr 03, 2016 3:36 pm

Thanks for the info, and also for being active a lot on the forum.
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